Post reflow flux residue: 55 percent . Acid value: 190-210. Flux residue dryness: pass. Use this solder anywhere you would use normal solder. M.G. Coefficient of thermal expansion: pure Sn=23.5. Tensile strength: 4312 psi. Density: 7.39 g/cc. Chemicals no clean Lead-Free Solder was designed with 96.3 percent tin, 0.7 percent copper and 3 percent silver alloys as a lead-free alternative for the standard Tin and Lead solder. Flux meets J-STD-004B Lead Free & no clean soldering wire It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Upper temperature limit: do not to exceed 350 degree C (tip temperature). Wire diameter: 0.032 (0.81 mm). Standard wire gauge: 21. Tolerance: +/- 0.002. Hardness, brinell: 15HB. 4900P-25G | Lead Free Solder Paste SAC305 | RS MG Chemicals - 4900-227G SAC305, 96.3% Tin, 0.7% Copper, 3% Silver, No... Choose Dorman for trusted replacement parts that deliver quality, performance, and peace of mind. Upgrade your vehicle today with Exhaust Gas Temperature Bung Repair Kit - Female , 904-533 , and experience the reliability and durability that Dorman products provide Silver Solder For Jewelry Making G Cheicals SAC305, 96.3% Tin, 0.7% Copper, 3% Silver, No Clean Lead Stained Glass Solder M.G. Chemicals Unleaded Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. This special activator exhibits virtually no spattering. A unique flux system was specifically used for high temperature Unleaded alloys. Typical flux percentage for our Unleaded Solder is 2.0-4.0 percent. Activator conforms to J-STD-004, REL0. Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications. Ag content: 2.8-3.2 percent . Cu content: 0.3-0.7 percent . Sn content: Balance. Flux classification: ORL0. Copper mirror: no removal of copper film. Silver chromate: pass. Corrosion: pass.
