Specifications: Model: MECHANIC-UV80; Color: Yellow, Weight: 0.08kg; Viscosity: 0.2Pas; Granularity: 0.22um; Packing: Aluminum box. High bond strength, PH value neutral, insulation is strong, welding surface smooth, is no corrosive for IC and PCB. MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair, electric Soldering Iron Welding Fluxes for phone circuit board repair. PECISION POWE BASS SIGNAL POCESSO EQ - COSSOVE PECISION POWE BASS SIGNAL POCESSO PECISION BP8 With its rosin-based flux paste, this solder paste ensures strong and durable solder joints, making it ideal for circuit board PCB, BGA, SMD, and PGA repair... MECHANIC Original Solder Tin Paste 158℃ Melting Point Welding Flux Soldering Cream Repair Pcb Bga Cpu Led Rework Tools Its boiling point only slightly higher than the melting point of the solder, For mobile phones, PC cards and other sophisticated electronic chip-level help welding. APPLICABLE: Advanced Paste Flux Soldering for phone motherboard Repair, Electric Soldering Iron Welding Fluxes for phone circuit board repair DESIGN: Its boiling point only slightly higher than the melting point of the solder BRAND: MECHANIC High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream MATERIAL: High bond strength, PH value neutral, insulation is strong, welding surface smooth WHAT YOU GET: 80G Solder Flux Paste with aluminum box Rosin Soldering Flux Paste Allows solder to form strong, long lasting mechanical and electrical bonds Wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron. Flux Paste Soldering OSFT Mechanic UV-50 BGA Activated Rosin Solder Paste Tin Rosin-Based Solder Flux
